Takulandilani patsamba lathu.

Chip chabwino cha thermistor ku China

Kufotokozera Kwachidule:

Poyerekeza ndi anzawo ku China, kusasinthika kwa magawo onse a chip yathu ndikwabwino kwambiri, ndipo zotsatira za kuyesa kwa kutentha kwakukulu ndizapadera kwambiri. Nyengo akatswiri Chip ayenera kudziwa pamwamba 250 ° C, kuwonjezeka kulikonse kwa 10 ° C ukalamba, kukana mtengo kusintha mlingo zambiri pawiri kapena kuposa, Chip wathu pa madigiri 260 kwa masiku 10, kukana mtengo kusintha mlingo ndi zosakwana 1%.


Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

High Precision NTC Thermistor Chip (NTC Temperature Sensor Chip)

NTC thermistor chips ndi tchipisi tating'ono tating'ono topanda golide kapena siliva takutidwa pamwamba ngati maelekitirodi, ndipo ndi oyenera ma module ophatikizika amitundu ingapo a ntchito zosakanizidwa pogwiritsa ntchito mawaya omangira kapena golide kapena solder ya manganese ngati njira yolumikizirana. Athanso kugulitsidwa mwachindunji ku waya wa malata, wokutidwa ndi faifi kapena wasiliva kuti apange masensa a kutentha.

Kuti mugwiritse ntchito NTC poyezera kutentha ndi kuwongolera, nthawi zambiri ndikofunikira kuyika chipangizo cha NTC chokhala ndi galasi kapena utomoni wa epoxy mumitundu yosiyanasiyana ya pulagi ndi filimu yopyapyala ya NTC thermistor.
NTC thermistor zigawo zikuluzikulu mu ntchito zambiri angagwiritsidwe ntchito mwachindunji kuyeza kutentha ndi kulamulira kutentha kudzera unsembe yoyenera, koma zambiri ndi kuwonjezera encapsulate thermistor mu zipangizo zosiyanasiyana ndi akalumikidzidwa a kafukufuku chipolopolo, ndi thermistor amatsogolera adzakhala olumikizidwa ndi mawaya specifications osiyana ndi utali, ndiye anasonkhana mu masensa kutentha kuyeza ndi kulamulira kutentha.

Mawonekedwe:

1) Itha kugwiritsidwa ntchito polumikizana, pogwiritsa ntchito mawaya agolide / aluminiyamu / siliva;
2) Kulondola kwakukulu mpaka ± 0.2%, ± 0.5%, ± 1%, etc.
3) Good kutentha mkombero kukana;
4) Kukhazikika kwakukulu ndi kudalirika;
5) Kukula kochepa

Mapulogalamu:

Ma Thermistors a Magalimoto (Seat Heating system,EPAS, Air kuyimitsidwa dongosolo, magalasi Galimoto ndi mawilo)
Bonding (infrared thermoelectric reactor, IGBT, mutu wosindikiza wotentha, Integrate module, semiconductor module, power mold, etc.)
Masensa a kutentha kwachipatala (Mayeso apamwamba kwambiri Otayidwa ndi Ogwiritsidwanso ntchito)
Kuwunikira mwanzeru (Jacket, Vest, Ski suit, baselayer, magolovu, Makasitomu)

Makulidwe:

Chip
chip size
SIZE L W T C
mm L+0.05 W+0.05 T±0.05 0.008±0.003
Kanthu Kodi Mkhalidwe woyesera Magwiridwe osiyanasiyana Chigawo
Adavotera kukana R25℃ +25℃±0.05℃PT≤0.1mw 0.5 ~ 5000 (± 0.5% ~±5%)
B mtengo B25/50 +25℃±0.05℃, +50℃±0.05℃PT≤0.1mw 2500 ~ 5000 (± 0.5% ~± 3%) K
Nthawi yoyankhira τ Mu Liquids 1 - 6 (malingana ndi kukula) S
Dsisipation factor δ Mumlengalenga 0.8-2.5 (malingana ndi kukula) mW/℃
Insulation resistance / 500VDC Pafupifupi 50
Opaleshoni Temp. Mtundu OTR Mumlengalenga -50+380
bare chip bonding

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